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Solder Paste
Non-Silicone material
Non-Silicone Thermal Greases
Gap Material
Patented Thermal Pad
Conductive Gasket
Thermal Conductive Adhesive Tape
Thermal Radiation Coating
Anisotropic Conductive Film
Silicone
Adhesive/Sealant
Encapsulant/Potting
Conformal Coating
Chip Protection
Die Attach
Thermal Pad
Thermal Greases
Thermal Conductive Glue
E2C
SMT Gum
Solder Bar/Wire
Anaerobic Adhesive
Anaerobic Adhesive
Structural Adhesive
Polyurethane
Adhesive/Sealant
PUR Degum Agent
Encapsulant/Potting
Special Polymer Material
Adhesive
UV Adhesive
Cyanoacrylate Adhesive
Cyanoacrylate Adhesive
Accelerator Series/Primer
Epoxy
SMT
Adhesive/Sealant
Encapsulant/Potting
Die Attach
Insulation
Phosphor
Ga YAG type phosphor
LuAG type phosphor
Nitride type phosphor
YAG type phosphor
Silicate type phosphor
Auxiliary Application Material
Anti-Sendimentation Agent
Diffusion Brightening Agent
Primer
Diluent
Release Agent
Stripper
others
Contact Us
Hansinde GmbH
Email:
info@hansinde.com
Website:
http://www.hansinde.com
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Thermal Pad
Hansinde HS-2012
Hansinde HS-0012
Hansinde HS-2651
Hansinde HS-0651
Hansinde HS-0051
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