组成(质量%)Composition(Mass%) | |
SN | PB |
余量Balance | 37.0±0.5% |
焊接合金之物理性质Solder alloy physical properties
熔融温度Melting points(°C) | ||
液相线Liquidus | DSC峰值DSC peak | 固相线Solidus |
183.0 | 183.0 | 183.0 |
密度(g/cm3) Density |
拉伸强度(Mpa) Tensile Strength |
延伸率(%) Elongation |
楊氏模量(Gpa) Young’s Module |
0.2%屈服点(Mpa) 0.2%Yield Point |
维氏硬度(Hv) Vickers Hardness |
8.4 | 56 | 59 | 26.3 | 45.8 | 16.6 |
锡粉规格Solder powder specification
类型Type | 目数Mesh | 粒度分布PSD(um) |
T4 | -400/+635 | 20-38 |
技术数据
物理性质Physical properties
项目Ctegory | 值/结果Values/Results | 测试方法/说明Methods/Remarks |
外观 Appearance |
外观灰白色,圆滑膏状,无明显分层。Shall not have separarated flux,and shall be in smooth paste state | 目视 Visual inspection |
金属含量% Metal Loading% |
90.00 | IPC-Z-3197 8.1.2 |
粘度 Viscosity Pa.S |
160±30 pa.s |
JIS-Z-3284 6@ Malcom PCU-205:10RPM 3Min 25±1°C<60%RH |
粘着性 Tack |
Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96 gm | JIS-Z-3284 9 |
扩散率% Spread Test% |
>80% | JIS-Z-3197-8.3.1.1 |
锡球实验 Solder Ball Test |
可接受Acceptable | JIS-Z-3284 11 |
坍塌测试 Slump Test |
No bridges all spacings | JIS-Z-3284 7,8 |
印刷寿命 Stencil Life |
>4小时Hours | @50%RH,23°C(74°F) |
再印刷留置时间 A bandon Time |
30-60分钟 Minutes | @50%RH,23°C(74°F) |
化学性质Chemical properties
活性级别 Activity Level |
ROM0 | IPC J-STD-004 |
卤素含量 ppm Halide content ppm |
>1500ppm | JIS-Z-3197 8.1.1.2.1 |
铜镜腐蚀 Copper Mirror |
没有腐蚀发生,NO Corrosion Occur | JIS-Z-3197 8.4.2 |
铜板腐蚀 Copper Corrosion | 发生腐蚀现象Evidence of Corrosion | JIS-Z-3258 8.4.1 |
电气性能
表面絕緣阻抗 SIR |
Ordinary state 1×1012〔Ω〕or above After humidifying 1×109〔Ω〕or above After 100hrs.in humidity | JIS Z-3284-14 |
電遷移 Electromigration |
Pass,Test Conditions: 65°C,88.5% RH for 596 hrs | IPC –TM-650,2.6.14.1 |
型号包括: