YC series is a kind of lead-free no-clean solder paste, which is specially designed for superfineprinting and back flow. With the wide window, it can provide surface mount technology for 0402mm (01005inch). Yc series could provide excellet impressionability for all plates, expecially for superfine compondents of 0.16mm in 8 hours.
Excellet backfow could achieve the better soldering effects on Cu OSP, even using high-moisture curve (60-90 sec@ 180-190 dgreen) in air and nitrogen.Also, it has the excelletperformance of preventing irregular tin bals and MCSB tin balls. With good appearance, TF138 is easy to bedetected.
Moreover, YC series could achive the level of IPC CLASS 3 and ROL0 IPC to ensure the highliability.