TF 135 Series Solder Paste is no-clean lead-free solder paste speially designed for superfine printing, paste and backflow. TF135 series could be used in air and nitrogen. The wide window technolgoy of TF135 series could be used in air and introgen. The wide window technolgoy of TF135 series could ensure the better soldering performance on the surface of OSP Immersion Ag, Immersion ENIG and lead-free HASL.
TF135 serise belongs ot ROLO materials. Its cavity performance couldachieve the third level of IPC to snsure the long-term liability.
| Code | Alloy Composition |
| P6337 | Sn63/Pb37 |
| 9440 | Sn60/Pb40 |
| 5545 | Sn55/Pb45 |
| 5050 | Sn50/Pb50 |
| 6204 | Sn62.8/Pb36.8/Ag0.4 |
| 621 | Sn62.5/Pb36.5/Ag1 |
| 622 | Sn62/Pb36/Ag2 |
| Sn43/Pb43/Bi14 | |
| Sn59/Pb38/Bi3 | |
| 882 | Sn10/Pb88/Ag2 |
| 925 | Sn5/Pb92.5/Ag2.5 |
| M305 | Sn96.5/Ag3.0/Cu0.5 |
| M0307 | Sn99/Ag0.3/Cu0.7 |
| 405 | Sn95.5/Ag4/Cu0.5 |
| Sn97.5/Ag2.0/Cu0.5 | |
| 105 | Sn98.5/Ag1/Cu0.5 |
| 307 | Sn99.3/Cu0.7 |
| 703 | Sn95/Sb5 |
| 955 | Sn90/Sb5 |
| 9010 | Sn95/Sb10 |
| 9010 | Sn90/Sb10 |
| Sn42/Bi57.6/Ag0.4 | |
| Sn82.5/Bi17/Cu0.5 | |
| Sn69.5/Bi30/Cu0.5 | |
| Sn64.7/Bi35/Ag0.3 | |
| Sn64/Bi35/Ag1 | |
| 3807 | Sn95.5/Ag3.8/Cu0.7 |
| 307Ni | Sn99.3/Ni0.7 |
| 4258 | Sn42/Bi58 |
| 351 | Sn64/Bi35/Ag1 |
| 1705 | Sn82.5/Bi17/Cu0.5 |
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