TF138 is a kind of lead-free no clean solder paste, which can be used inany circumstances. The speial design of wide window would minimize the trasfer of lead to non-lead. Solder paste provides the technology of lead one. TF138 would show excellent impressionability of printing different plates, especially in the application of superfine printing and high ooutput.
Excellent backflow technology could be helpful in welding Cu OSP, which is the good combination of all types printing, and which is the good combination of all types printing. Also, it has the excellet erformance of preventing irregular tin bals and MCSB tin balls. With good appearance, TF138 is easy to be detected. Moreover, TF138 seriescould achive the level of IPC CLASS III and ROL0 IPC to ensure the hight liability.